منابع مشابه
Surface Micromachining for Microelectromechanical Systems
Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films. Originally employed for integrated circuits, films composed of materials such as low-pressure chemical-vapor-deposition polycrystalline silicon, silicon nitride, and silicon dioxides can be sequentially deposited and selectively removed to build or “machine” three-dimensional stru...
متن کاملFailure modes for stiction in surface-micromachined MEMS
Wafer-level testing of surface-micromachined sensors provides ncw challenges to the test community. Currently, there is no method available for performing direct measurements to assess faulty micromechanical structures. Most commercial methods use electrical measurements to deduce the physical source of failures in the micromechanical structure. As a result, the process of identifyang various f...
متن کاملWater-soluble sacrificial layers for surface micromachining.
This manuscript describes the use of water-soluble polymers for use as sacrificial layers in surface micromachining. Water-soluble polymers have two attractive characteristics for this application: 1) They can be deposited conveniently by spin-coating, and the solvent removed at a low temperature (95-150 degrees C), and 2) the resulting layer can be dissolved in water; no corrosive reagents or ...
متن کاملPhotolithographic surface micromachining of polydimethylsiloxane (PDMS).
A major technical hurdle in microfluidics is the difficulty in achieving high fidelity lithographic patterning on polydimethylsiloxane (PDMS). Here, we report a simple yet highly precise and repeatable PDMS surface micromachining method using direct photolithography followed by reactive ion etching (RIE). Our method to achieve surface patterning of PDMS applied an O(2) plasma treatment to PDMS ...
متن کاملThick-layer resists for surface micromachining
Interest in thick-photoresist applications is steadily growing. In addition to bump fabrication and wire interconnect technology (WIT), the process of patterning thick-layer photoresists by UV lithography is specially qualified for applications in microelectromechanical systems (MEMS). Specialized equipment and new photoresists have been developed or are under development to cope with the new c...
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ژورنال
عنوان ژورنال: Journal of Micromechanics and Microengineering
سال: 1996
ISSN: 0960-1317,1361-6439
DOI: 10.1088/0960-1317/6/4/005